Professional PCB Assembly & Electronics Manufacturing

Surface-Mount-Device (SMD) Assembly

• Board quantities from 1-piece to medium-volume batch sizes
• Single-sided, mixed (SMD/THD) and double-sided SMD-Assembly
• Components from 0201, QFP 0.4mm, 50mm x 50mm and special sizes
• Quality assurance through optical inspection systems

Our SMD-production line consists of:

• Stencil holder Quattro-Flex II (LTC)
• Fully automatic Stencil Printer BS1400 (Autotronik)
• Automatic SMD Pick-and-Place System BS384V (Autotronik)
• Full convection Reflow Oven RO300FC (Essemtec)
• Optical Assembly Inspection System Quins-Easy (Quins)
• Optical SMD-, BGA Inspection System Ersascope (Ersa)

Through-Hole-Device (THD) Assembly

• Board quantities from 1-piece to medium-volume batch sizes
• Mixed THD- and SMD Assembly
• Hand assembly and manual-/automatic Soldering

Our THD-production line consists of:

• Component cut-and-bend machines (Variocut, Loupot)
• Half-automatic THD Pick-and-Place Laser tables (Heeb)
• Dual-wave Soldering machine ATF 13/25 (ATF)

Assembly Repair (Rework) and Recovery of SMD-Components

• No minimum board quantity
• Rework and repair of falsely assembled boards
• Recovery of components on assembled boards (BGAs, QFNs, etc.)

Our SMD-Rework bench consists of:

• Professional Rework System IR-XT5P (PDR)
• Multi-Digital Repair Station WMD 1S (Weller)
• Digital Dispenser DX-200 (OKI)

Assembly Repair

"A well known problem encountered by hardware design engineers during tests and measurements of their new prototype boards is when a fine-pitch/lead-less device needs replacing."

Standard soldering tools often prove inadequate; WEEng offers reliable, cost-effective and top-quality replacement using professional rework systems.

Recovery and Recycling of SMD-Components

The company recovers expensive, hard-to-source components (ASICs, FPGAs, microcontrollers, BGAs, connectors, inductors) from assembled boards for reuse.

Material Procurement, Cable and Product Assembly, Test

Material Procurement

The purchasing department sources components globally and leverages bulk purchasing for competitive pricing. For common SMD components, they source internally to reduce machine changeover time, passing savings to clients. Challenges addressed include lead-times, obsolescence, and counterfeit parts.

Product Assembly and Test

Services extend beyond board assembly to final product assembly including programming, enclosure fitting, cable integration, testing, shipping, and post-shipment repairs/upgrades.

EMS Dictionary

0201 — SMD component size (0.6mm x 0.3mm metric)

0402 — SMD component size (1.0mm x 0.5mm metric)

0603 — SMD component size (1.6mm x 0.8mm metric)

0805 — SMD component size (2.0mm x 1.25mm metric)

1206 — SMD component size (3.2mm x 1.6mm metric)

AOI — Automated Optical Inspection. Detects manufacturing defects in printed circuit assemblies through automated optical inspection techniques.

AXI — Automated X-ray Inspection for defect detection.

BGA — Ball Grid Array with typical 1.27mm spacing; newer versions feature 0.8mm or 0.5mm spacing.

EMS — Electronic Manufacturing Services (contract manufacturing).

MELF — Metal Electrode Leadless Face (5.8mm x 2.2mm)

Mini MELF — Smaller variant (3.6mm x 1.4mm)

Micro MELF — Smallest variant (2.2mm x 1.1mm)

PCB — Printed Circuit Board. Electrically connects components using conductive (mainly copper) tracks on a non-conductive material.

QFN — Quad Flat No-lead with pads; typical spacings 0.5–0.65mm.

QFP — Quad Flat Package with pins on four sides.

Rework — Replacing defective components using specialised equipment like the IR-XT5P system.

Rigid-Flex — Construction connecting rigid PCBs via flexible ribbon with conductive traces.