WEEng
GmbH

Electronic Design Services

Our design and engineering expertise is at your disposal from the initial product design concept, through to the re-design of existing assemblies.

Electronic Development
Firmware Development
Printed Circuit Board Layout
Prototype Assembly
Assembly Re-design

Electronic Development

Key capabilities:

  • 8-/16-/32-bit microcontrollers
  • Analog, digital, mixed-signal circuitry
  • Climatic testing (−40°C to +130°C)
  • EMC compliance testing

Our experience includes:

  • Circuit design, dimensioning, worst-case analysis, simulations, design
    reviews
  • 68332, PIC12/16/18, ST7, COP8, LPC2106 (ARM7), M16C microcontrollers
  • Embedded USB, USB hub, Ethernet controller interfaces, MR angle sensorsMixed-signal components (ADC, DAC, discrete, op-amps, SMPS buck, boost)
  • I²C (SMBus), (Q)SPI, Dallas 1-Wire bus hardware
  • LIN, CAN, FlexRay bus transceiver hardware
  • Motor control (stepper, brush DC, 3-phase BLDC motors)
  • EMC compliance testing, supervision and evaluation
Weeng design featured image

Firmware Development

Key capabilities:

  • 8-/16-/32-bit microcontrollers
  • C / assembly languages
  • Modular structured design
  • Maintainable, documented source code

Our experience includes:

  • USB controller driver, enumeration and slave communication
  • Integration of COTS TCP/IP stack and Ethernet controller driver
  • I²C (SMBus), (Q)SPI, Microwire, Dallas 1-Wire, UART device code
  • Porting of firmware between microcontroller architectures
  • Bootloader implementation using non-volatile Flash memory
  • Various PIC12/16/18, ST7, COP8 microcontroller C and assembly code
  • Various 68332 (CPU32), LPC1206 (ARM7) C source code
Partial C firmware code displaying static unsigned char declarations and pointer definitions with color syntax highlighting.

Printed Circuit Board Layout

Key capabilities:

  • Single, double, multi-layer boards (AL-based, FR2, FR4 high Tg 170°C)
  • SMD and THD components
  • EMC-conform placement and layout
  • CAM file generation and third-party PCB fabrication

Our experience includes:

  • Mixed routing (through-hole / SMD fine-pitch)
  • Power, analog, digital segregation for reduced EMI
  • Impedance-controlled traces for HF signals
  • Test points for rapid test, maintenance and repair
  • Protel 99SE, Altium Designer CAD and Gerber viewers
Stack of green printed circuit boards with integrated circuits, vias, copper traces, and electronic components displaying detailed PCB layout and assembly.

Prototype Assembly

Key capabilities:

  • SMD and THD assembly
  • RoHS / lead-free soldering
  • Prototypes and small series runs
  • Material procurement (components, PCBs, stencils, solder paste, etc.)

Our experience includes:

  • Electrical functionality tests after board assembly
  • PCB panelisation for optimum cost/performance
  • Microcontroller, Flash memory, PLD and FPGA programming
Hand holding green PCB prototype with metal testing fixture or assembly jig in background, demonstrating prototype inspection and assembly workflow.

Assembly Re-design

Key capabilities:

  • Replacement for obsolete original parts
  • Cost-effective adaptor PCBs
  • Re-designs from a schematic, a PCB or a complete product

Our experience includes:

  • Adaptor PCBs for obsolete THD components
  • Reproducing a controller board 1:1 including mechanical dimensions
  • Redesigning a product consisting of 4 THD PCBs to a single SMD PCB including complete functional software
Compact green PCB assembly with large integrated circuit chip and connector pins, showing consolidated and optimized circuit redesign.